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  <channel rdf:about="https://www.um.edu.mt/library/oar/handle/123456789/2070">
    <title>OAR@UM Collection:</title>
    <link>https://www.um.edu.mt/library/oar/handle/123456789/2070</link>
    <description />
    <items>
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        <rdf:li rdf:resource="https://www.um.edu.mt/library/oar/handle/123456789/143683" />
        <rdf:li rdf:resource="https://www.um.edu.mt/library/oar/handle/123456789/143682" />
        <rdf:li rdf:resource="https://www.um.edu.mt/library/oar/handle/123456789/142199" />
        <rdf:li rdf:resource="https://www.um.edu.mt/library/oar/handle/123456789/142102" />
      </rdf:Seq>
    </items>
    <dc:date>2026-04-23T23:17:53Z</dc:date>
  </channel>
  <item rdf:about="https://www.um.edu.mt/library/oar/handle/123456789/143683">
    <title>Design and electronic interfacing of FR4 and polyimide PCB-based electromagnetic resonating micro-mirrors</title>
    <link>https://www.um.edu.mt/library/oar/handle/123456789/143683</link>
    <description>Title: Design and electronic interfacing of FR4 and polyimide PCB-based electromagnetic resonating micro-mirrors
Authors: Dimech, Nikolai; Grech, Ivan; Farrugia, Russell; Casha, Owen; Portelli, Barnaby; Micallef, Joseph
Abstract: This paper presents the design and fabrication of an electromagnetically actuated PCB-based resonating scanning micro-mirror for LiDAR applications, with optimization targeted towards low-cost fabrication and a high scanning angle. Traditional silicon MEMS-based micro-mirrors, while offering high precision and compatibility with CMOS processing, are limited by fragility at low scanning frequencies and costly fabrication processes. To overcome these challenges, novel alternative polymer-based substrates, namely FR4 and polyimide (PI), were employed to implement PCB-compatible mirror prototypes. Electromagnetic actuation was chosen because it achieves a high scanning angle at low driving voltages and is therefore compatible with modern electronic drive circuitry. The resonant frequency and von Mises stresses were assessed via COMSOL finite element simulations. Various scanning mirror prototypes, each featuring an optical mirror aperture of 10 mm by 10 mm, were fabricated using two different materials: 0.3 mm-thick FR4 and polyimide substrates. Different electromagnetic coil structures, embedded on the mirror plate, were evaluated with the aim of optimizing the scanning performance. The magnetic field was generated using neodymium permanent magnets. The performance attained by each prototype is compared and discussed. The scanning mirrors were designed to have a low resonant frequency in the range of 250 Hz to 550 Hz. The maximum optical scanning angle achieved for the FR4 and polyimide substrates are 31.3° and 52.1°, respectively. The paper also delves into the design of a microcontroller-based electromagnetic actuation and sensing circuitry of the mirror. Custom electronic circuitry comprising a low-power STM32L432KC microcontroller, H-bridge motor drivers for mirror actuation, and INA241-based coil voltage and current sensing was designed for this purpose. The coil voltage and current sensing circuitry enable the eventual real-time sensor less angular position feedback of the micro-mirror.</description>
    <dc:date>2026-01-01T00:00:00Z</dc:date>
  </item>
  <item rdf:about="https://www.um.edu.mt/library/oar/handle/123456789/143682">
    <title>Characterization of PCB fabrication processes for a systematic and efficient design of microstrip circuits</title>
    <link>https://www.um.edu.mt/library/oar/handle/123456789/143682</link>
    <description>Title: Characterization of PCB fabrication processes for a systematic and efficient design of microstrip circuits
Authors: Casha, Owen
Abstract: This paper proposes an algorithm to aid in the&#xD;
characterization of a printed circuit board fabrication process&#xD;
before the design of microstrip circuits. By accurately characterizing&#xD;
the electrical properties of a printed circuit board process,&#xD;
one can achieve a systematic and efficient design of microstrip&#xD;
circuits with reduced iteration cycles. The algorithm employs a&#xD;
mean-squared-error optimization technique while making use&#xD;
of de-embedded scattering parameter data from some sample&#xD;
microstrip transmission lines, to estimate printed circuit board&#xD;
electrical parameters such as the tangent loss and the relative&#xD;
permittivity, for a particular frequency range.</description>
    <dc:date>2025-07-01T00:00:00Z</dc:date>
  </item>
  <item rdf:about="https://www.um.edu.mt/library/oar/handle/123456789/142199">
    <title>Experimental investigation of thermal tuning for laterally excited bulk acoustic wave MEMS resonators using SOI bulk heating</title>
    <link>https://www.um.edu.mt/library/oar/handle/123456789/142199</link>
    <description>Title: Experimental investigation of thermal tuning for laterally excited bulk acoustic wave MEMS resonators using SOI bulk heating
Authors: Bengashier, Munira; Casha, Owen; Grech, Ivan; Farrugia, Russell; Micallef, Joseph; Gatt, Edward
Abstract: This paper presents the experimental investigation of electrothermal fine frequency tuning for a 60 MHz&#xD;
laterally excited contour mode bulk acoustic wave MEMS resonator, fabricated using the PiezoMUMPs multiprocess&#xD;
wafer process. Tuning is achieved via electrothermal SOI bulk heating of the resonator, so that its&#xD;
resonant frequency is shifted by inducing additional stresses in the device, as well as varying its elastic&#xD;
properties via a temperature change. Experimental results show that the resonant frequency decreases with an&#xD;
increase in the electrical heating power, which is applied to the resonator SOI bulk via two heating electrodes.&#xD;
For a 50-mW heating power swing, the resonator frequency varies from 61.368 MHz to 61.418 MHz. Measured&#xD;
results show that the SOI bulk resistance remains approximately constant over this tuning range, with a value&#xD;
of around 31 Ω . The discussion of the experimental results is aided and confirmed via finite element modelling&#xD;
and simulation.</description>
    <dc:date>2024-10-01T00:00:00Z</dc:date>
  </item>
  <item rdf:about="https://www.um.edu.mt/library/oar/handle/123456789/142102">
    <title>An analytical approach for designing passive matching networks</title>
    <link>https://www.um.edu.mt/library/oar/handle/123456789/142102</link>
    <description>Title: An analytical approach for designing passive matching networks
Authors: Casha, Owen
Abstract: This paper presents an analytical approach for designing three-component T-section or π-section passive matching networks by using a direct and generic impedance or admittance network analysis. This approach is proposed as an alternative technique for designing such networks, which can be achieved through either a graphical approach using an impedance-admittance Smith chart, a back-to-back L-section-based matching network design, or a phase-shift-based approach. The proposed approach provides all possible T-section or π-section passive matching network configurations and their respective component values with high accuracy by analytically solving three equations, as demonstrated by the implemented algorithm.</description>
    <dc:date>2025-11-01T00:00:00Z</dc:date>
  </item>
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