Please use this identifier to cite or link to this item: https://www.um.edu.mt/library/oar/handle/123456789/106625
Title: Process for suppressing the nucleation and/or growth of interstitial type defects by controlling the cooling rate through nucleation : U. S. Patent Application Publication No. 2003/0196587 A1
Authors: McCallum, Kirk D.
Alexander, W. Brock
Banan, Mohsen
Falster, Robert J.
Holzer, Joseph C.
Johnson, Bayard K.
Bum Kim, Chang
Kimbel, Steven L.
Lu, Zheng
Mutti, Paolo
Voronkov, Vladimir V.
Mule’ Stagno, Luciano
Libbert, Jeffrey L.
Keywords: Nucleation
Silicon
Crystals
Semiconductors
Ingots
Issue Date: 2003
Publisher: United States Patent and Trademark Office
Citation: McCallum, K., Alexander, W., Banan, M., Falster, R., Holzer, J., Johnson, B., ... & Libbert, J. (2003). Process for suppressing the nucleation and/or growth of interstitial type defects by controlling the cooling rate through nucleation. (U. S. Patent Application Publication No. 2003/0196587 A1). United States.
Abstract: The present invention relates to a process for growing a Single crystal Silicon ingot, which contains an axially symmetric region having a predominant intrinsic point defect and which is Substantially free of agglomerated intrinsic point defects in that region. The process comprising cooling the ingot from the temperature of solidification to a temperature of less than 800° C. and, as part of said cooling step, quench cooling a region of the constant diameter portion of the ingot having a predominant intrinsic point defect through the temperature of nucleation for the agglomerated intrinsic point defects for the intrinsic point defects which predominate in the region.
URI: https://www.um.edu.mt/library/oar/handle/123456789/106625
Appears in Collections:Scholarly Works - InsSE



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