The Department of Microelectronics and Nanoelectronics manages various labs which are equipped with the latest technology. The department has access to state-of-the-art design and simulation software packages and testing equipment.
Cadence: Integrated Circuit Design and Simulation
CoventorWare: Multiphysics numerical simulation software for MEMS prototyping
MEMS+: System-level modelling of MEMS
SEMulator3D: 3D virtual fabrication prototyping for semiconductors and MEMS
HP 20 GHz RF Network Analyser
Advantest R3265A Spectrum Analyser (100 Hz to 8 GHz)
Tektronix Two Channel Digitising Oscilloscope TDS 820 (6 GHz)
Maury Microwave Corporation NGA Frequency Extender Model MT7551B (1.8 GHz to 18 GHz)
Maury Microwave Corporation Noise Gain Analyser Model MT 2075
Two-port Pocket VNA 2.0 (500 kHz to 4 GHz)
Vibrating Sample Magnetometer - The Lake Shore Model 7404 Vibrating Sample Magnetometer (VSM) system accurately measures major and minor hysteresis loops, remanence curves, and much more under full software automation. Vector/torque and automated sample rotation options extend the utility of the 7400 series VSM for magnetic anisotropy studies.
Compass Tester - A 3-D electromagnetic MEMS compass test module complete with magnetic stimulus having a magnetic field range of ±3mT. The system includes analogue and digital interface for interfacing various types of MEMS compass as various stages of development. The system includes a temperature-controlled environment for a range of −40 °C to 125 °C.
Optical breadboard installed in a black-out enclosure for MOEMS laser characterization. Equipment available included: M-squared beam profilometer, position sensitive detectors, global shutter camera, shack hartmann wavefront sensor, linear and rotating stages, laser power meter, beam expanders. Available laser sources include He-Ne laser, nanosecond-pulsed laser and a selection of LED lasers.
Single Axis Force Shaker : The force shaker is designed to reproduce a vibration environment. Qualification tests on MEMS components and small assemblies can be reproduced under controlled conditions using a wide frequency band. The shaker operates in the frequency range of 5 Hz to 10 kHz using a sine or random input waveform, converting an electrical current into mechanical force. It is mainly used for the testing of inertial MEMS sensors including modal investigation and vibration stress testing under varied environmental conditions. The system includes a temperature-controlled environment for a range of −40 °C to 180 °C.
Shock Test Machine Avex SM-105 : The shock machine is used in the design and destructive drop testing of MEMS components, ASICs, hybrids, and complete assemblies of up to 22 kg. Shock testing within the range of 3g to 30,000g can be performed together with half sine, sawtooth and square wave pulses.
2 Axis Positioning Table : The IX-Blue EVO20-TC is a high precision two-axis positioning and rate table equipped with temperature control. It is aimed at testing and calibrating MEMS sensors, inertial systems and components such as multi-axis accelerators and gyroscopes. The system includes a temperature-controlled environment for a range of −40 °C to 80 °C.
Vacuum Chamber : The custom-built vacuum chamber with dimensions of 8”×8”×8” is constructed from 1 inch thick clear acrylic. The chamber is rated for vacuum levels down to 0.1 torr and is helium leak tested to 10-8 atm-cc/sec range. It also includes a 2.75” optical window with an anti-reflective coating for optical MEMS characterisations. The vacuum chamber is a useful tool for the analysis of air pressure dependence on sensor performance (ex: quality factor).
Cascade Probing Station - Temperature controlled together with standard and RF differential probes
Micromechanical Testing Station - The Femtotools FT-RS1002 is a high precision three-axis nano-manipulation unit used to probe various micro mechanical structures. The instrument is designed to perform highly accurate probe-based force-position-time measurements which enable a large number of testing modes. Typical modes include compression/tensile testing, adhesion force testing, actuation force testing, deflection range testing, and distance and topography measurements.